JPH0347576B2 - - Google Patents
Info
- Publication number
- JPH0347576B2 JPH0347576B2 JP59171660A JP17166084A JPH0347576B2 JP H0347576 B2 JPH0347576 B2 JP H0347576B2 JP 59171660 A JP59171660 A JP 59171660A JP 17166084 A JP17166084 A JP 17166084A JP H0347576 B2 JPH0347576 B2 JP H0347576B2
- Authority
- JP
- Japan
- Prior art keywords
- regions
- layer
- conductivity type
- groove
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 22
- 239000011810 insulating material Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 26
- 235000012239 silicon dioxide Nutrition 0.000 description 13
- 239000000377 silicon dioxide Substances 0.000 description 13
- 239000004642 Polyimide Substances 0.000 description 9
- 229920001721 polyimide Polymers 0.000 description 9
- 239000000758 substrate Substances 0.000 description 7
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 239000012535 impurity Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- -1 e.g. Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/74—Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D10/00—Bipolar junction transistors [BJT]
- H10D10/60—Lateral BJTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
- H10D62/177—Base regions of bipolar transistors, e.g. BJTs or IGBTs
- H10D62/184—Base regions of bipolar transistors, e.g. BJTs or IGBTs of lateral BJTs
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Element Separation (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US565678 | 1983-12-27 | ||
| US06/565,678 US4547793A (en) | 1983-12-27 | 1983-12-27 | Trench-defined semiconductor structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60142564A JPS60142564A (ja) | 1985-07-27 |
| JPH0347576B2 true JPH0347576B2 (en]) | 1991-07-19 |
Family
ID=24259659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59171660A Granted JPS60142564A (ja) | 1983-12-27 | 1984-08-20 | 半導体構造体 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4547793A (en]) |
| EP (1) | EP0150328B1 (en]) |
| JP (1) | JPS60142564A (en]) |
| DE (1) | DE3474613D1 (en]) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH083763B2 (ja) * | 1986-09-17 | 1996-01-17 | 三洋電機株式会社 | リップルフイルタ |
| US4914740A (en) * | 1988-03-07 | 1990-04-03 | International Business Corporation | Charge amplifying trench memory cell |
| US4970689A (en) * | 1988-03-07 | 1990-11-13 | International Business Machines Corporation | Charge amplifying trench memory cell |
| US4929996A (en) * | 1988-06-29 | 1990-05-29 | Texas Instruments Incorporated | Trench bipolar transistor |
| US5017999A (en) * | 1989-06-30 | 1991-05-21 | Honeywell Inc. | Method for forming variable width isolation structures |
| US5234861A (en) * | 1989-06-30 | 1993-08-10 | Honeywell Inc. | Method for forming variable width isolation structures |
| US5248894A (en) * | 1989-10-03 | 1993-09-28 | Harris Corporation | Self-aligned channel stop for trench-isolated island |
| US5065217A (en) * | 1990-06-27 | 1991-11-12 | Texas Instruments Incorporated | Process for simultaneously fabricating isolation structures for bipolar and CMOS circuits |
| US5952707A (en) * | 1997-12-05 | 1999-09-14 | Stmicroelectronics, Inc. | Shallow trench isolation with thin nitride as gate dielectric |
| US6022788A (en) * | 1997-12-23 | 2000-02-08 | Stmicroelectronics, Inc. | Method of forming an integrated circuit having spacer after shallow trench fill and integrated circuit formed thereby |
| US6255184B1 (en) | 1999-08-30 | 2001-07-03 | Episil Technologies, Inc. | Fabrication process for a three dimensional trench emitter bipolar transistor |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3385729A (en) * | 1964-10-26 | 1968-05-28 | North American Rockwell | Composite dual dielectric for isolation in integrated circuits and method of making |
| JPS5228550B2 (en]) * | 1972-10-04 | 1977-07-27 | ||
| US3919005A (en) * | 1973-05-07 | 1975-11-11 | Fairchild Camera Instr Co | Method for fabricating double-diffused, lateral transistor |
| US4199775A (en) * | 1974-09-03 | 1980-04-22 | Bell Telephone Laboratories, Incorporated | Integrated circuit and method for fabrication thereof |
| US4048649A (en) * | 1976-02-06 | 1977-09-13 | Transitron Electronic Corporation | Superintegrated v-groove isolated bipolar and vmos transistors |
| DE2605641C3 (de) * | 1976-02-12 | 1979-12-20 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Hochfrequenztransistor und Verfahren zu seiner Herstellung |
| US4137109A (en) * | 1976-04-12 | 1979-01-30 | Texas Instruments Incorporated | Selective diffusion and etching method for isolation of integrated logic circuit |
| US4115797A (en) * | 1976-10-04 | 1978-09-19 | Fairchild Camera And Instrument Corporation | Integrated injection logic with heavily doped injector base self-aligned with injector emitter and collector |
| FR2410366A1 (fr) * | 1977-11-29 | 1979-06-22 | Radiotechnique Compelec | Transistor de type mesa et procede de realisation de ce transistor |
| US4174252A (en) * | 1978-07-26 | 1979-11-13 | Rca Corporation | Method of defining contact openings in insulating layers on semiconductor devices without the formation of undesirable pinholes |
| US4283236A (en) * | 1979-09-19 | 1981-08-11 | Harris Corporation | Method of fabricating lateral PNP transistors utilizing selective diffusion and counter doping |
| US4242156A (en) * | 1979-10-15 | 1980-12-30 | Rockwell International Corporation | Method of fabricating an SOS island edge passivation structure |
| US4373965A (en) * | 1980-12-22 | 1983-02-15 | Ncr Corporation | Suppression of parasitic sidewall transistors in locos structures |
| US4419150A (en) * | 1980-12-29 | 1983-12-06 | Rockwell International Corporation | Method of forming lateral bipolar transistors |
-
1983
- 1983-12-27 US US06/565,678 patent/US4547793A/en not_active Expired - Fee Related
-
1984
- 1984-08-20 JP JP59171660A patent/JPS60142564A/ja active Granted
- 1984-11-30 DE DE8484114425T patent/DE3474613D1/de not_active Expired
- 1984-11-30 EP EP84114425A patent/EP0150328B1/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| US4547793A (en) | 1985-10-15 |
| JPS60142564A (ja) | 1985-07-27 |
| EP0150328B1 (en) | 1988-10-12 |
| DE3474613D1 (en) | 1988-11-17 |
| EP0150328A1 (en) | 1985-08-07 |
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